The high Tg material is specially formulated for superior performance through multiple thermal excursions, passing 6x solder tests at 288 degrees C. It is also optimized for enhanced drilling performance allowing high aspect ratio holes of less than or equal to 10 mil. It’s unique resin chemistry provides CAF resistance with the benefit of long-term reliability of boards built with small feature designs. Along with these attributes, it brings improved productivity with its fast cure system while using current fabrication techniques.
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