They’re ideal for using smaller, future-driven components on a wide scale. They offer faster signal transmission and a significant reduction in signal loss and crossing delays – and are ideal for shrinking down the PCB size.
Our Chicago-based manufacturer partners use a plate-shut process which ensures more reliability for micro via processes as opposed to a process filled with non-conductive ink and then plating over. The micro via formation technology uses lasers to drill micro vias, also called blind via-holes (BVHs). With the ability to place on or off the pads, these holes let you selectively create routing room in denser parts of the substrate.
The smaller parts used on HDI boards have shorter internal wire lengths. This provides reduced rise times and lower power requirements when compared to their larger, alternative packages.
HDIs create a gateway to miniaturization of PCB design with ‘via in pad’ technology.
By stepping up technology rather than compromising existing design rules.
When it comes to BGA layout with the smallest pitch.
By reducing plated thru holes, pad size and conductor size.
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