Make the most of smaller components.
Utilize HDIs (high density interconnection) for a higher wiring density per unit area.
They’re ideal for using smaller, future-driven components on a wide scale. They offer faster signal transmission and a significant reduction in signal loss and crossing delays – and are ideal for shrinking down the PCB size.
Our Chicago-based manufacturer partners use a plate-shut process which ensures more reliability for micro via processes as opposed to a process filled with non-conductive ink and then plating over. The micro via formation technology uses lasers to drill micro vias, also called blind via-holes (BVHs). With the ability to place on or off the pads, these holes let you selectively create routing room in denser parts of the substrate.
